Markus Pfeiffer

This presentation introduces Electro-Optic Terahertz Pulse Reflectometry (EOTPR) as a non-destructive method for the localization of electrical opens and shorts within semiconductor device packages. EOTPR operates by generating a short electrical pulse, injecting it into the device, and analyzing the time-dependent reflection patterns to locate interruptions. This technique is effective for determining both the presence and position of package failures.
In this presentation, we show application examples for localizing opens in various packages: complex BGA package, flex circuit board, D2PAK power package, and a power module for electromobility.
Together with the University of Stuttgart we investigated the D2PAK power package deeper concerning the amount of open bond wires. By using a principal component analysis we were able to distinguish, if one, two or three bond wires contribute to the electrical dysfunctionality.
For the EOTPR analysis, it is necessary to work with references. For this, electrical opens often have to be prepared inside the package. This is done, for example, by removing the mold compound, subsequently cutting traces or bond wires, and then resealing packages.

Markus Pfeiffer earned his diploma in physics from the University of Stuttgart in 2008. He completed his PhD in 2013 at the Max Planck Institute for Solid State Research and the University of Stuttgart, working in the field of ultrafast nano-optics. Until 2018, he worked as a postdoctoral researcher in the nano-optics group of the Institute of Physical Chemistry at the University of Cologne. In 2019, he joined Bosch Mobility Electronics as an engineer for failure analyses.