Matthias Muehle

Diamond is an ultra-wide bandgap semiconductor material, whose electric properties make it a great choice as p-type material for device integration. Further, diamond possesses the highest thermal conductivity, which also makes it a great choice for use and integration within thermal cooling solutions.

This talk discusses a familiar of diamond-based technologies that were developed by Fraunhofer USA, Center Midwest, Fraunhofer IFAM and Fraunhofer IMWS to address cooling challenges within the various components of a semiconductor system:
(1) A single-crystalline diamond nanomembrane technology is presented, which enables device integration of boron-doped diamond layers with other semiconductor materials through means of heterointegration.
(2) A polycrystalline diamond nanomembrane technology portfolio is presented, which can be used as thermal interface material or as heatsink.
(3) A copper-diamond composite material, produced by gel-casting and spark-plasma-sintering, that can be used as heatsink with thermal conductivity exceeding that of copper by 3x is showcased.

Matthias Muehle received the Diploma degree in physics from Technische Universität Dresden, Germany, and the Ph.D. degree in electrical engineering from Michigan State University, USA, in 2017. He is currently the Manager Diamond Technologies at Fraunhofer USA, Center Midwest (CMW), overseeing materials research of diamond for use in semiconductors, analytical electrochemistry, neurology and water treatment. He has 15 years of experience working in diamond synthesis, wafer fabrication and device applications. His personal research focus is on diamond growth for (ultra) wide bandgap semiconductor integration.