Ryan Sweeney

As industries expand their use of silicon photonic integrated circuits (PICs), it is imperative that manufacturers be able to continuously improve the quality of their manufactured PICs. To do so, fault isolation of unwanted defects is necessary.
Electrical fault isolation tools are typically comprised of a photoemission camera, thermal camera, and a laser scanning microscopy system. These same isolation tools can be used to perform fault isolation on PICs. The photoemission camera captures short-wave infrared light, capable of capturing three photonic light input wavelengths (O, C, and L-bands) and can be used to isolate any areas within a waveguide feature that the input/signal light is being emitted and lost. The thermal camera, with ability to capture mid-wave and long-wave infrared emissions is useful in mapping dynamic and steady state temperatures of PICs integrated and co-packaged with electrical circuits.
The presentation will discuss challenges of using state of the art 300nm electrical fault isolation tools for PICs including variations of electro-optical test setup, imaging challenges in 3D co-packaged samples, and the limitations of laser scanning microscopy.

Ryan is currently a Senior Member of the Technical Staff at GlobalFoundries. Since joining GlobalFoundries, he has worked within the failure analysis lab on technologies from 32nm SOI to 7nm FinFET and 45nm silicon photonics technology nodes. Prior to GlobalFoundries, Ryan worked at Micron Technology where he worked in the failure analysis lab on various NAND and DRAM technology nodes, as well as spending two years as a shift lead managing technicians and early career engineers. Ryan graduated from Rochester Institute of Technology with Honors with a BS in Microelectronic Engineering in 2008 and from University at Albany with a Master in Business Administration in 2021.