Christopher Benndorf

Hybrid bonding is a key technology for next-generation 3D integration in microelectronics, enabling extremely high contact and packing densities with millions of interconnects per mm², as well as improved signal integrity and energy efficiency. However, the combination of direct bonding of dielectrics and thermocompression bonding of copper pads results in complex failure modes with both chemical and mechanical-physical origins. To analyze these challenges, Fraunhofer IMWS applies a combination of high-resolution (S)TEM and highly sensitive ToF-SIMS for failure analysis of hybrid wafer bonding systems. ToF-SIMS enables depth-resolved and lateral chemical characterization of the bonding interface, detecting even trace amounts of oxides, nitrides, and contamination. (S)TEM complements this with nanoscale insight into structural integrity, revealing voids, cracks, interfacial roughness, and Cu-Cu contact quality. Correlating both methods links chemical and structural information directly to electrical failures, supporting root-cause analysis and process optimization for reliable 3D integrated systems.

Studied chemistry, followed by a PhD in inorganic solid-state chemistry and physical chemistry at Westfälische Wilhelms-Universität Münster, with a focus on solid-state NMR spectroscopy of intermetallic phases and polypnictides.
Research associate and junior research group leader at University of Leipzig (2017–2024).
Since 2024, researcher at the Fraunhofer Institute for Microstructure of Materials and Systems IMWS in Halle (Saale), focusing on ToF-SIMS and TEM as tools for failure analysis in microelectronics and wafer bonding.