Sergii Gudyriev

Micro-Transfer Printing has already been proven as successful technology for RnD and Prototyping, allowing integration of different materials and components in a single system, significantly improving the performance, or enabling unique functionality. However, to qualify this technology for industrialization, further aspects of reliability and yield have to be considered. An overview of this technology will be provided with highlights of main reliability considerations and potential solutions.

Sergii Gudyriev holds Master’s degree in Information Technology and Microelectronics and has experience in both electronic and photonic IC design. He has joined X-FAB in 2021 as Photonics Principal Engineer and is now working on the industrialization of the photonic technologies.

Falk Naumann

Application-relevant and accurate material parameters or degradation models are essential for numerical reliability assessments of microelectronic devices. The required properties are often technology- or process-specific and can deviate significantly from literature values or bulk materials. Growing system integration and component miniaturization further complicates robust parameter identification at defined samples. To obtain relevant, locally resolved data on actual components, Fraunhofer IMWS employs various nanoindentation techniques to characterize the mechanical and thermos-mechanical behavior of semiconductor structures and packaging materials. In this talk, application scenarios for local property assessment of semiconductors and packaging materials will be presented. The case study covers required preparation routines, temperature-dependent material testing, and material property mapping of complex structures. Examples include the characterization of different passivation layers, degradation effects, and the measurement of mechanical strength values.

Falk Naumann received the degree in mechanical engineering at the Technical University of Dresden. Since 2006, he has been working at the Fraunhofer Institute for Mechanics of Materials IMWS in Halle. As team manager for micromechanical characterization and numerical modeling, he is involved in research activities related to material characterization and reliability modeling of materials and systems used in microelectronics and power electronic applications.

Christopher Benndorf

Hybrid bonding is a key technology for next-generation 3D integration in microelectronics, enabling extremely high contact and packing densities with millions of interconnects per mm², as well as improved signal integrity and energy efficiency. However, the combination of direct bonding of dielectrics and thermocompression bonding of copper pads results in complex failure modes with both chemical and mechanical-physical origins. To analyze these challenges, Fraunhofer IMWS applies a combination of high-resolution (S)TEM and highly sensitive ToF-SIMS for failure analysis of hybrid wafer bonding systems. ToF-SIMS enables depth-resolved and lateral chemical characterization of the bonding interface, detecting even trace amounts of oxides, nitrides, and contamination. (S)TEM complements this with nanoscale insight into structural integrity, revealing voids, cracks, interfacial roughness, and Cu-Cu contact quality. Correlating both methods links chemical and structural information directly to electrical failures, supporting root-cause analysis and process optimization for reliable 3D integrated systems.

Studied chemistry, followed by a PhD in inorganic solid-state chemistry and physical chemistry at Westfälische Wilhelms-Universität Münster, with a focus on solid-state NMR spectroscopy of intermetallic phases and polypnictides.
Research associate and junior research group leader at University of Leipzig (2017–2024).
Since 2024, researcher at the Fraunhofer Institute for Microstructure of Materials and Systems IMWS in Halle (Saale), focusing on ToF-SIMS and TEM as tools for failure analysis in microelectronics and wafer bonding.

Pouya Tavousi

Advanced microelectronics failure analysis and metrology require rapid access through heterogeneous stacks (mold compound, underfill, metals, dielectrics, silicon). Tescan FemtoChisel is an ultrashort-pulsed laser platform for high-throughput sample preparation, focused on decapsulation/delayering and millimeter-scale cross-sectioning. It removes encapsulants to expose die/package regions for optical/SEM inspection and probing, performs stepwise delayering to reveal circuitry, silicon, and interposer metallization, and produces large-area cross sections with high feature visibility. These capabilities are enabled by intelligent multigas processing (during/between scans) to control plume, cooling, and debris evacuation, plus a removable laser protective layer (LPL) that suppresses peripheral beam interactions and protects nearby features during high-energy ablation. Together they reduce redeposition and collateral damage, expanding the usable high-fluence window for scalable advanced-package FA.

Pouya Tavousi is Head of AI and Advanced Solutions at TESCAN and previously co-founded FemtoInnovations, which was acquired by TESCAN in 2025. He leads advanced solution development at the intersection of ultrafast laser micromachining, correlative microscopy, and AI-enabled laser processing and image analysis. His work focuses on automating end-to-end workflows that fuse multimodal imaging with data-driven navigation, and on developing software that enables high-throughput sample preparation for advanced microelectronics—including decapsulation, delayering, and large-area cross-sectioning—for failure analysis and metrology.

Jiaqi Tang

Advanced packages, such as 2.5D and 3D architectures, enable significant improvements in performance and bandwidth, while reducing overall footprint. However, as package complexity increases with multiple dies and components integrated into one package, failure analysis methodologies must evolve to accommodate these changing architectures.
One of the challenges in failure analysis on 2.5D/3D packages is sample preparation; ensuring the region of interest is exposed while minimizing impact on the failure site. This presentation will discuss the application of Microwave Induced Plasma (MIP) in sample preparation workflows, where localized MIP etching is applied from top-down, bottom-up, and cross-sectional approaches. Package-level case studies will cover underfill removal to expose μbump and dies in CoWoS packages, and polyimide removal to expose copper RDL in InFO packages. Latest developments on MIP+ etching for die-level and board-level sample preparation will cover selective Si removal for backside access to Si die, GaN-on-Si die, and bridge die for fault isolation, as well as silicone sealant removal to access components on PCB board and flex cable.

Jiaqi Tang is the CTO of JIACO Instruments, a company he co-founded in 2014 to develop and commercialize Microwave Induced Plasma (MIP) technology for advanced sample preparation in failure analysis of packaged IC devices. With over 17 years of experience, he leads a multidisciplinary team focused on fundamental MIP research and application development, working in close collaboration with industrial users of the MIP systems.
Jiaqi received his Ph.D. in microelectronics from Delft University of Technology, M.Sc. from University of Pennsylvania, and B.Sc. from Fudan University. He has published more than 30 papers and serves on the Technical Program Committee for IPFA and ESREF conferences.

Ryan Sweeney

As industries expand their use of silicon photonic integrated circuits (PICs), it is imperative that manufacturers be able to continuously improve the quality of their manufactured PICs. To do so, fault isolation of unwanted defects is necessary.
Electrical fault isolation tools are typically comprised of a photoemission camera, thermal camera, and a laser scanning microscopy system. These same isolation tools can be used to perform fault isolation on PICs. The photoemission camera captures short-wave infrared light, capable of capturing three photonic light input wavelengths (O, C, and L-bands) and can be used to isolate any areas within a waveguide feature that the input/signal light is being emitted and lost. The thermal camera, with ability to capture mid-wave and long-wave infrared emissions is useful in mapping dynamic and steady state temperatures of PICs integrated and co-packaged with electrical circuits.
The presentation will discuss challenges of using state of the art 300nm electrical fault isolation tools for PICs including variations of electro-optical test setup, imaging challenges in 3D co-packaged samples, and the limitations of laser scanning microscopy.

Ryan is currently a Senior Member of the Technical Staff at GlobalFoundries. Since joining GlobalFoundries, he has worked within the failure analysis lab on technologies from 32nm SOI to 7nm FinFET and 45nm silicon photonics technology nodes. Prior to GlobalFoundries, Ryan worked at Micron Technology where he worked in the failure analysis lab on various NAND and DRAM technology nodes, as well as spending two years as a shift lead managing technicians and early career engineers. Ryan graduated from Rochester Institute of Technology with Honors with a BS in Microelectronic Engineering in 2008 and from University at Albany with a Master in Business Administration in 2021.

Bartu Bisgin

The increasing complexity of advanced semiconductor packages, driven by chiplet architectures and 2.5D/3D integration, challenges conventional failure localization methods such as lock-in thermography (LIT) and complicates current Failure Analysis (FA) workflows. Dense redistribution layers and buried interconnects limit the ability of established techniques to understand failure mechanisms non-destructively. In this work, we validate quantum diamond microscopy (QDM) based on nitrogen-vacancy (NV) centers in diamond as a non-destructive localization method through magnetic current path imaging at the package level. Using commercial Integrated Fan-Out Package-on- Package (InFO-PoP) devices from iPhones, we showcase a complete FA workflow that includes QDM to localize a short-type failure at an Integrated Passive Device (IPD) at the package backside. We showcase that the QDM results provide invaluable information on top of conventional techniques and can significantly enhance root-cause identification in package-level FA workflows. This work demonstrates the potential of QDM for broader integration into semiconductor chip and package analysis workflows.

Bartu Bisgin is Applications Lead at QuantumDiamonds, where he leads customer validation projects and bridges advanced quantum technology with real-world FA use cases. With a MSc in Quantum Science & Technology from TUM/LMU, he brings both technical depth and practical insight. Over the past two years, Bartu has focused on translating cutting-edge research into reliable, customer-ready solutions, working closely with partners across industries.

Lukas Uhlig

Photonics components exhibit at least electrical and optical functional properties, as in transceivers or image sensors for instance. In addition, mechanical functions may come to the fore, as it is the case e.g.with mechanically controllable filters or micro scanners. Characterization and testing methods are therefore highly complex, with the generation and detection of electrical signals and optical radiation, the measurement of motion, and material and surface properties playing a major role.
Photonics is becoming commercially attractive for high-speed communication, imaging across a wide wavelength range (UV… MIR), sensor technology, and even for interconnecting chiplets within a microsystem, as well as for quantum computing. The development of efficient testing methods is therefore becoming increasingly important. This contribution discusses various methods for characterizing different photonic components used in sensor technology, information transmission, and quantum technology, illustrating these with examples and addressing the measurement of electrical, optical, and mechanical properties. Finally, it explores a concept for a universally applicable photonic testing system.

Dr. Lukas Uhlig is a researcher in the field of integrated photonics and quantum technologies at the Fraunhofer Institute for Electronic Nano Systems (ENAS). He studied physics at TU Chemnitz and received his PhD in 2025 with a thesis on the dynamical behavior of nitride-based laser diodes. Since 2025, he is working at Fraunhofer ENAS on the design, simulation, and characterization of integrated photonic components, and on ion traps for quantum computing. He published over 20 peer-reviewed papers and contributed to over 15 scientific conferences, including two invited talks. He was awarded the Springer Thesis Award and the TU Chemnitz University Prize 2025.

Kristof Croes

Silicon photonics, a technology where optical and electronic components are integrated on the same platform, is rapidly growing from a small niche to a technology enabler for higher speed data transmission in data centers, telecommunications, and high-performance computing.  Such fast growing field poses challenges and opportunities for the reliability and failure analysis engineers working in this field. This presentation overviews such challenges and opportunities encountered in the context of imec’s Silicon Photonics reliability research. For each developed device (being photo diodes, modulators, heaters, lasers, …), the related degradation mechanisms will be introduced together with their proposed testing and qualification methodologies and failure analysis challenges. The basics of each device will be introduced in detail such that the presentation can be followed by a broader audience with interests in reliability and failure analysis.

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Jacob Hornung

In January and February 2026, VDI/VDE Innovation + Technik GmbH conducted a survey on the topics of failure analysis, testing, and metrology on behalf of the Federal Ministry of Research, Technology, and Space (BMFTR), the results of which are to be used as part of the Concerted Action “Roadmapping Microelectronics Strategy and High-Tech Agenda.” To continue involving the community in the process, the results of the survey will be presented here at the CAM-Workshop.

Since 2022: Scientific Advisor at VDI/VDE Innovation + Technik GmbH

2021: Ph.D. in Physics

2017–2021: Research Associate at the Helmholtz-Zentrum Dresden-Rossendorf