Falk Naumann

Application-relevant and accurate material parameters or degradation models are essential for numerical reliability assessments of microelectronic devices. The required properties are often technology- or process-specific and can deviate significantly from literature values or bulk materials. Growing system integration and component miniaturization further complicates robust parameter identification at defined samples. To obtain relevant, locally resolved data on actual components, Fraunhofer IMWS employs various nanoindentation techniques to characterize the mechanical and thermos-mechanical behavior of semiconductor structures and packaging materials. In this talk, application scenarios for local property assessment of semiconductors and packaging materials will be presented. The case study covers required preparation routines, temperature-dependent material testing, and material property mapping of complex structures. Examples include the characterization of different passivation layers, degradation effects, and the measurement of mechanical strength values.

Falk Naumann received the degree in mechanical engineering at the Technical University of Dresden. Since 2006, he has been working at the Fraunhofer Institute for Mechanics of Materials IMWS in Halle. As team manager for micromechanical characterization and numerical modeling, he is involved in research activities related to material characterization and reliability modeling of materials and systems used in microelectronics and power electronic applications.