Patrick Rostam-Khani

Zero-failure strategies in mission critical applications are pushing reliability towards physics-of-degradation driven reliability testing, beyond the current state-of-the-art test methods. This session presents a highly accelerated vibration test approach linking in‑situ electrical signals directly to solder damage evolution. Physically non-destructive, AI-assisted 3D X-ray microscopy replaces the inaccurate, slow, and more labour-intensive physical cross-sectioning method. This shortens physical analysis cycles and enables remaining useful lifetime prediction under real-world stress loading scenarios.

Dr. Patrick Rostam Khani is currently working as Principal Engineer in the Surface/Material Analysis Group at NXP Semiconductors, based in Nijmegen (The Netherlands). With more than 25 years of experience in Material and Surface Analysis in several roles within the Product Diagnostic and Quality Center Organization of NXP, he works at the intersection of materials characterization, physics of failure, and data driven reliability modeling for advanced electronic packages. Patrick’s work contributes to linking physical degradation mechanisms to measurable signals and simulation models, enabling predictive assessment of reliability under realistic operating conditions. He is actively involved in applying AI assisted approaches to support zero failure strategies into electronics. Patrick received his Ph.D. in Instrumental Analytical Chemistry from the Johann Wolfgang Goethe University of Frankfurt am Main.