Innovation in Failure Analysis and Material Diagnostics of Electronics Components

20th and 21st May 2025

Halle, Germany

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There are currently only two booths left. Head over to the exhibition area to reserve your booth.

Welcome

Dear colleagues,

we are delighted to invite you to the 12th CAM-Workshop on „Failure Analysis and Material Diagnostics of Electronics Components“ on 20th and 21st May 2025.

As usual, the CAM-Workshop will bring together experts from the electronics industry and material diagnostics equipment manufacturers. The goal is to discuss challenges, innovative solutions, and future requirements in the field of failure analysis and material characterization of electronic devices, sensors, and systems.

In addition to the scheduled oral presentations, there will be an industrial exhibition featuring suppliers of failure analysis and material diagnostics equipment. This unique concept allows for direct interaction between electronics failure analysis experts and diagnostics equipment manufacturers. It has helped establish the CAM workshop as an internationally recognized event and a hub for failure diagnostics in electronics.

We are excited to welcome all of you to Halle next May.

Frank Altmann

on behalf of the CAM-Workshop committee

Technical Topics

The workshop will concentrate on failure analysis and material diagnostics of electronics components with a specific focus on:

  • Trends in semiconductor technologies, system integration solutions and electronics materials as well as the resulting demands on failure analysis, material diagnostics and quality assurance method
  • New results in fault isolation, target preparation and defect analysis applications
  • Case studies of failure diagnostics work flows for innovative technologies
  • Innovation in material characterization and defect analysis methods
  • Progress in developments of new diagnostics tools and equipment solutions

 

Meet our CAM-Workshop Committee

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Frank Altmann

Fraunhofer IMWS (Germany)
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Ingrid De Wolf

IMEC and KU Leuven (Belgium)
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Pascal Gounet

STMicroelectronics (France)
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Joerg Krinke

Robert Bosch GmbH (Germany)
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Thomas Schweinboeck

Infineon Technologies AG (Germany)
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Szu Huat Goh

Qualcomm (Singapore)
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Jeroen Jalink

NXP Semiconductors (The Netherlands)
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Andreas Meyer

Globalfoundries (Germany)