Innovation in Failure Analysis and Material Diagnostics of Electronics Components

19 and 20 May 2026

Halle, Germany

Registration is now open. Register now for the  early bird rate of 300 Euro per person (until 20. March 2026).

Welcome

Dear colleagues,

welcome to the 13th CAM Workshop on “Failure Analysis and Material Diagnostics of Electronics Components,” taking place on 19–20 May 2026 in Halle (Saale), Germany

This year, we are pleased to highlight the APECS Pilot Line — with integrated CTR (Characterization Test Reliability) capabilities — as a European cornerstone for semiconductor innovation under the EU Chips Act.

APECS (Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems) is the novel pan-European pilot line that provides Europe with innovation capabilities in advanced packaging and heterogeneous integration of systems. By providing large companies, SMEs, start-ups, and other stakeholders with access to critical services, skills, and training to integrate and package chiplets into novel electronic components and systems, APECS plays a pivotal role in strengthening/securing Europe’s technological resilience and competitiveness. We look forward to discussing pressing challenges, tools, and the opportunities the APECS ecosystem creates for professionals and organizations worldwide.

We look forward to welcoming you to Halle in May 2026.

Kindest regards,

Frank Altmann on behalf of the CAM-Workshop committee

Technical Topics

The workshop will concentrate on failure analysis and material diagnostics of electronics components with a specific focus on:

  • Trends in semiconductor technologies, system integration solutions and electronics materials as well as the resulting demands on failure analysis, material diagnostics and quality assurance method
  • New results in fault isolation, target preparation and defect analysis applications
  • Case studies of failure diagnostics work flows for innovative technologies
  • Innovation in material characterization and defect analysis methods
  • Progress in developments of new diagnostics tools and equipment solutions

 

Meet our CAM-Workshop Committee

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Frank Altmann

Fraunhofer IMWS (Germany)
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Ingrid De Wolf

IMEC and KU Leuven (Belgium)
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Pascal Gounet

STMicroelectronics (France)
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Joerg Krinke

Robert Bosch GmbH (Germany)
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Thomas Schweinboeck

Infineon Technologies AG (Germany)
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Szu Huat Goh

Qualcomm (Singapore)
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Jeroen Jalink

NXP Semiconductors (The Netherlands)
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Andreas Meyer

Globalfoundries (Germany)