Innovation in Failure Analysis and Material Diagnostics of Electronics Components

27 and 28 April 2027

Halle, Germany

Welcome

Technical Topics

The workshop will concentrate on failure analysis and material diagnostics of electronics components with a specific focus on:

  • Trends in semiconductor technologies, system integration solutions and electronics materials as well as the resulting demands on failure analysis, material diagnostics and quality assurance method
  • New results in fault isolation, target preparation and defect analysis applications
  • Case studies of failure diagnostics work flows for innovative technologies
  • Innovation in material characterization and defect analysis methods
  • Progress in developments of new diagnostics tools and equipment solutions

 

Meet our CAM-Workshop Committee

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Frank Altmann

Fraunhofer IMWS (Germany)
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Ingrid De Wolf

IMEC and KU Leuven (Belgium)
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Pascal Gounet

STMicroelectronics (France)
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Joerg Krinke

Robert Bosch GmbH (Germany)
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Thomas Schweinboeck

Infineon Technologies AG (Germany)
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Szu Huat Goh

Qualcomm (Singapore)
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Jeroen Jalink

NXP Semiconductors (The Netherlands)
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Andreas Meyer

Globalfoundries (Germany)