CAM-Workshop Program 2026
Day 1 (19 May 2026)
08:00 – 09:00 Registration
Session A: 3D Heterogeneous Integration
| 09:00 – 09:05 | Frank Altmann | Fraunhofer IMWS (DE) | Welcome |
| 09:05 – 09:20 | Jacob Hornung | VDI/VDE Innovation + Technik GmbH (DE) | Results of the survey on “Failure Analysis, Testing, and Metrology” conducted as part of the concerted action—Roadmapping HTAD and the Microelectronics Strategy of the Federal Government |
| 09:20 – 10:00 | Ping-Yi Hsieh | imec (BE) | Keynote: Reliability challenges of Silicon Photonic devices and its related Failure Analysis challenges |
| 10:00 – 10:40 | Przemyslaw Jakub Gromala | Robert Bosch GmbH (DE) | Keynote: AI/ML-Driven Paradigms for Heterogeneous Integration: Digital Twin, Intelligent Reliability and Failure Analysis |
Session A (continued): 3D Heterogeneous Integration
| 11:00 – 11:20 | Christopher Benndorf | Fraunhofer IMWS (DE) | Defect characterization of hybrid bonded systems |
| 11:20 – 11:40 | Sergii Gudyriev | XFAB (DE) | Reliability considerations for Micro-Transfer Printing of Photonic Components |
| 11:40 – 12:00 | Ryan Sweeney | Global Foundries (US) | Failure Analysis Techniques and Lab Requirements for Silicon Photonics Fault Isolation |
| 12:00 – 12:20 | Lukas Uhlig | Fraunhofer ENAS (DE) | Characterization and test of photonic components in micro systems |
Session A (continued): 3D Heterogeneous Integration
| 13:40 – 14:00 | Bartu Bisgin | Quantum Diamonds GmbH (DE) | Quantum Diamond Microscopy for Non-Destructive Failure Analysis of an Integrated Fan-Out Package-on-Package iPhone Chip |
| 14:00 – 14:20 | Jiaqi Tang | Jiaco Instruments (NL) | Microwave Induced Plasma Etching for 2.5D/3D Advanced Package Sample Preparation |
| 14:20 – 14:40 | Pouya Tavousi | TESCAN (US) | Tescan FemtoChisel: High-Throughput Decapsulation, Delayering, and Large-Area Cross-Sectioning for Advanced Microelectronics |
| 14:40 – 15:00 | Falk Naumann | Fraunhofer IMWS (DE) | Local material characterization for heterogeneous system integration using nanoindentation techniques |
Session B: Wide Bandgap Technologies
| 15:40 – 16:20 | Vincent Gambin | Northrop Grumman Corporation (US) | Keynote: Development of next-generation UWBG electronics for high-reliability industry applications |
| 16:20 – 16:40 | Matthias Mühle | Fraunhofer CMW (US) | Diamond-based technologies for active device and thermal cooling integration |
| 16:40 – 17:00 | Mervi Paulasto-Kroeckel
Marek Patocka |
Aalto University (FI) | Materials and Device Challenges of UWBG AlN/AlGaN for Power Electronics |
| 17:00 – 17:20 | Martin Čalkovský | Thermo Fisher Scientific Brno (CZ) | Revelios: Semi-automated, non-destructive crystalline defect metrology for GaN based epitaxial layers |
Social Events
| 17:20 – 18:00 | Drinks Reception in the exhibition area |
| 18:00 – 22:00 | Networking Dinner in der gardens |
Day 2 (20. May 2026)
Session C: Tutorial
| 08:00 – 09:00 | Sebastian Brand | Fraunhofer IMWS (DE) | Defect localization by Acoustic Microscopy |
Session D: Advanced Failure Analyse Techniques
Session E: Artificial Intelligence and Digitalization
| 13:40 – 14:00 | Patrick Rostam-Khani | NXP Semiconductors (NL) | Bringing Physics of Degradation Methodology in Board Level Vibration Testing |
| 14:00 – 14:20 | Lorenz Heinemann | Fraunhofer IMWS (DE) | Noise in SAM Data: When Similar Signals Lead to Different Diagnoses |
| 14:20 – 14:40 | Bernhard Fichtl | Carl Zeiss Microscopy GmbH (DE) | Exploring the value of instance segmentation & other AI methods for Failure Analysis |
| 14:40 – 15:00 | Michael Fritzsche | GlobalFoundries Fab1 (DE) | Integrated Digital Workflows for Accelerated Failure Analysis and Enhanced Yield Learning in Semiconductor Manufacturing |
| 15:00 – 15:20 | Amit Choudhary | Matworks GmbH (DE) | Accelerating and standardization of failure analysis through digital workflows and machine learning |