Chris Richardson

When analyzing semiconductor devices, particularly for failure or construction analysis, mechanical sample preparation is crucial. The main factor for successful preparation is to use the right tools that match the device’s complexity.
There is a growing belief that these complex devices require high-precision beam tools. However, these tools are often not designed for large-area analysis or high throughput. In contrast, mechanical sample preparation provides several advantages.
• High Throughput: Mechanical methods can process samples more quickly.
• Precision Over Large Areas: They maintain a high level of precision across larger surfaces.
• Cost-Effectiveness: Mechanical preparation is significantly less expensive compared to other methods, such as plasma focused ion beam (FIB) sample preparation.
In this talk, the focus will be on the benefits of using mechanical sample preparation tools for large-area analysis, specifically in the context of complex power silicon carbide (SiC) devices.

Chris Richardson has been working in the Semiconductor and Solar industries for 31 years in various roles, including electrical failure analysis, design circuit debug/edit, analytical services, and failure analysis tool development. His failure analysis background was developed while working with various companies including, NCR, Symbios Logic, LSI Corporation, Abound Solar and now Allied High Tech Products, where he is currently the X-Prep Product and Applications Manager. He received a M.S. in Electrical Engineering from the University of Colorado.