Thomas Reichart

The increasing demand for energy-efficient devices, such as electric vehicles (EVs) and renewable energy sources, highlights the importance of power devices for efficient energy management and conversion. New materials like SiC and GaN offer multiple advanteges compared to traditional Si-based devices. Hamamatsu Photonics K.K. (HPK) has introduced Optical Fault Isolation solutions to the semiconductor failure analysis market. HPK’s new PHEMOS-X high voltage solution supports up to 5kV without discharge, ensuring safety. Additionally, HPK is developing a low-temperature solution to prevent condensation with the current prober on PHEMOS-X. HPK also introduces Green OBIRCH for SiC devices. The rise of three-dimensional (3D) semiconductor devices has increased the need for advanced thermal imaging techniques. HPK presents a dual-capability system combining thermo-reflectance and thermal lock-in imaging (LIT) for high-speed, sensitive thermal analysis. This system effectively detects hotspots in 3D devices, such as 3D NAND flash memory and BSP-DN structured devices, offering a promising solution for thermal characterization of complex 3D semiconductor architectures.

Thomas Reichart earned his Master’s degree in Physics from Ulm University in 2018. Upon completing his studies, he commenced his professional career at Hamamatsu Photonics Deutschland GmbH, where he initially held the position of Service Engineer specializing in Failure Analysis Systems. In recognition of his expertise and contributions, he transitioned to the role of Application Engineer for Failure Analysis Systems in 2023.