Marc van Veenhuizen

Lockin Thermography is a great failure analysis technique to investigate shorts or in general resistive connections. By applying an RF-stimulus, it will be shown in this presentation that the technique can be made applicable for highly resistive and even (DC-) open connections. The stimulus itself will be discussed, as well as the experimental setup. Then, the RF-LIT technique will be demonstrated on a number of practical use cases, including MEMS and RDL, in order to show its applicability. In order to gain a better understanding why it works, a simulation model will be constructed. This will then subsequently be linked to experiments on MEMS which offer further insights on RF-LIT.

A graduate of the University of Groningen, The Netherlands, with a Master’s degree in both Theoretical (weak interactions) and Applied (spintronics) Physics. I continued my academic career at MIT, USA, where I pursued a PhD in experimental physics (spintronics).
After graduation I joined the Components Research department at Intel Corporation as BEOL integration engineer. After a 6 months trans-Atlantic ocean sailing hiatus I continued my professional career at ASML as a design engineer. Then, I became a Failure Analysis engineer at NXP supporting the new product introduction of a variety of products such as magnetic sensors, radar chips, MEMS, and software defined radio chips.