CAM-Workshop Program 2025
Day 1 (20. May 2025)
Session A: Welcome and Keynotes
| 09:00 – 09:40 | Prof. Dr. Erica Lilleodden / Frank Altmann | Fraunhofer IMWS (DE) | Welcome |
| 09:40 – 10:00 | Albert Heuberger | Fraunhofer IIS (DE) | Keynote: The APECS Pilot Line: European Chiplet Innovation |
| 10:00 – 10:40 | Kristof Croes | IMEC (BE) | Keynote: Reliability challenges of Silicon Photonic devices and its related Failure Analysis challenges |
| 10:40 – 11:20 | Mikel Azpeitia Urquia | ST Microelectronics (IT) | Keynote: MEMS: Smart sensors for a sustainable AI |
Session B: MEMS & Sensors
| 11:20 – 11:40 | Holger Pfaff | Infineon Technologies (DE) | Micromechanics without walking the plank- MEMS characterization at Infineon Regensburg |
| 11:40 – 12:00 | Roy Knechtel | University of Applied Sciences Schmalkalden (DE) | Understanding Wafer Bonded MEMS by (Failure) Analysis |
| 12:00 – 12:20 | Georg Spanring | AMS-Osram AG (AT) | Pinpointing Leakage Defects in TSVs: A Refined Failure Analysis Approach |
| 12:20 – 12:40 | Bernd Hähnlein | CiS Forschungsinstitut für Mikrosensorik (DE) | Implantation related crystallographic defects in pressure sensors |
Session C: Emerging Fault Isolation Techniques
| 14:00 – 14:20 | Neel Leslie | Thermo Fisher Scientific (US) | Exploring the Capabilities and Applications of E-beam probing for Failure Analysis |
| 14:20 – 14:40 | Michael Di Battista | Varioscale Inc. (US) | Innovative Approaches to Ultra Thinning Silicon to Enabling New Insights in IC Failure Analysis |
| 14:40 – 15:00 | Pascal Limbecker | GlobalFoundries Dresden Module One LLC & Co. KG (DE) | Challenges for Nanoprobing of 22nm FDSOI devices |
| 15:00 – 15:20 | Sebastian Brand | Fraunhofer IMWS (DE) | Precise 3D Defect Localization in quantitative Lock-in Thermography by analyzing the spatial phase distribution |
| 15:20 – 15:40 | Shimpei Tominaga | Hamamatsu (JP) | Application to a failure analysis of Visible ThermoDynamic ® Imaging |
| 15:40- 16:00 | Marc van Veenhuizen | NXP (NL) | RF-LIT background and use cases |
Session D: Vendor FA Road Map
| 16:40 – 16:50 | Kohei Kudo | Hamamatsu Photonics K.K.(JP) | Hamamatsu FA roadmap |
| 16:50 – 17:00 | Steffen Sturm | InfraTec GmbH Infrarotsensorik und Messtechnik (DE) | HD Lock-in Thermography for Failure Analysis in Electronics |
| 17:00 – 17:10 | Marc Heinemann | SmarAct Metrology GmbH & Co. KG (DE) | Minimizing Electron Dose during Nanoprobing |
| 17:10 – 17:20 | Chris Richardson | Allied High Tech Products (US) | TBD |
| 17:20 – 17:30 | Oytun Tasgit | 3D-Micromac AG (DE) | Efficiency Meets Precision: Advanced Laser Solutions for Sample Preparation |
| 17:30 – 17:40 | Libor Strakos | Thermo Fisher Scientific Brno s.r.o (CZ) | Thermo Fisher Scientific FA Road Map |
| 17:40 – 17:50 | TBD | ||
| 17:50 – 18:00 | NN | TESCAN GROUP, a.s (CZ) | TBD |
Day 2 (21. May 2025)
Session E: Tutorial
| 08:00 – 09:00 | Enrico Zanoni | University Padua (IT) | Tutorial: Deep level effects, failure modes and mechanisms of GaN HEMTs; current understanding and open questions |
Session F: GaN Electronics
| 09:40 – 10:20 | Thomas Detzel | Infineon Technologies Austria AG (AT) | Keynote: Gallium Nitride Power Devices and Systems: Benefits and Industrial Realization |
| 10:20 – 10:40 | Victor Sizov | Nexperia (NL) | Cascode GaN devices for high power application |
| 10:40 – 11:00 | Aidan Taylor | Infineon Villach (AT) | A direct correlation of dislocation characterization in GaN by scanning electron and scanning transmission electron microscopes |
| 11:00 – 11:20 | Marc Fouchier | Attolight (CH) | Defect characterization in compound semiconductors using cathodoluminescence |
| 11:20 – 11:40 | Michél Simon-Najasek | Fraunhofer IMWS (DE) | Novel approach of combined planar and cross-sectional defect analysis of stressed normally-on HEMT devices with leaky Schottky gates |
| 11:40 – 12:00 | Daniel Wetzel | X-FAB (DE) | Reliability characterization challenges for wide bandgap power electronics |
| 12:00 – 12:20 | Sebastian Fritzsche | Heraeus Electronics GmbH & Co. KG (DE) | Towards affordable GaN power modules – advanced interconnect materials & solutions |