20. May 2025 14:40 – 15:00 Emerging Fault Isolation Techniques Challenges for Nanoprobing of 22nm FDSOI devices Pascal Limbecker GlobalFoundries Dresden Module One LLC & Co. KG I Germany Abstract Globalfoundries’ 22nm FDSOI (22FDX®) technology offers full SoC integration including digital, analog and RF. It combines high performance and ultra-low power. With body-biasing it is…
20. May 2025 15:40 – 16:00 Emerging Fault Isolation Techniques RF-LIT background and use cases Marc van Veenhuizen NXP I The Netherlands Abstract Lockin Thermography is a great failure analysis technique to investigate shorts or in general resistive connections. By applying an RF-stimulus, it will be shown in this presentation that the technique can be…
20. May 2025 15:20 – 15:40 Emerging Fault Isolation Techniques Application to a failure analysis of Visible ThermoDynamic ® Imaging Shimpei Tominaga Hamamatsu I Japan Abstract The emergence of three-dimensional (3D) semiconductor devices has increased the importance of thermal imaging techniques. We present a dual-capability system combining thermo-reflectance and thermal lock-in imaging (LIT) for high-speed,…