Template_SessionC

Abstract, SessionC

20. May 2026 09:20 – 10:00 Tutorial The APECS Pilot Line: European Chiplet Innovation Ulrike Ganesh Fraunhofer IZM I Germany Abstract How APECS leads the way in heterogeneous integration by providing diverse technologies on a single platform including failure analysis and material diagnostics for microelectronics Under the EU Chips Act, the APECS (Advanced Packaging and Integration for…

Brand

Abstract, SessionC

20. May 2026 08:00 – 09:00 Tutorial Defect localization by Acoustic Microscopy Sebastian Brand Fraunhofer IMWS I Germany Abstract For a couple of decades now acoustic microscopy is a relevant and widely used technique in quality assessment, technology development and microelectronic failure analysis. Due to its non-destructive mode of operation, it allows for contactless defect…