20. May 2026 08:00 – 09:00 Tutorial Defect localization by Acoustic Microscopy Sebastian Brand Fraunhofer IMWS I Germany Abstract For a couple of decades now acoustic microscopy is a relevant and widely used technique in quality assessment, technology development and microelectronic failure analysis. Due to its non-destructive mode of operation, it allows for contactless defect…
19. May 2026 14:40 – 15:00 3D Heterogeneous Integration Local material characterization for heterogeneous system integration using nanoindentation techniques Falk Naumann Fraunhofer IMWS I Germany Abstract Application-relevant and accurate material parameters or degradation models are essential for numerical reliability assessments of microelectronic devices. The required properties are often technology- or process-specific and can deviate significantly…
19. May 2026 16:40 – 17:00 Wide Bandgap Technolgies Materials and Device Challenges of UWBG AlN/AlGaN for Power Electronics Mervi Paulasto-Kröckel Marek Patocka Aalto University I Finland Abstract UWBG AlN and AlGaN are attracting increasing interest for next-generation power electronics, but their development involves major challenges in epitaxy, contacting and device design as material composition…
20. May 2026 11:20 – 11:40 Advanced Failure Analyse Techniques See while you mill – SEM guided FIB milling and low-kV finishing for leading-edge node semiconductor FA with ZEISS Crossbeam 750 Heiko Stegmann Carl Zeiss Microscopy GmbH I Germany Abstract The requirements to sample preparation for transmission electron microscopy (TEM) using combined scanning electron microscope…
20. May 2026 14:40 – 15:00 Artificial Intelligence and Digitalization Integrated Digital Workflows for Accelerated Failure Analysis and Enhanced Yield Learning in Semiconductor Manufacturing Michael Fritzsche GlobalFoundries Fab1 I Germany Abstract Failure analysis in semiconductor manufacturing requires fast and reliable access to many different data sources. As IT environments continue shifting toward cloud‑based solutions, traditional,…
19. May 2026 11:00 – 11:20 3D Heterogeneous Integration Defect characterization of hybrid bonded systems Christopher Benndorf Fraunhofer IMWS I Germany Abstract Hybrid bonding is a key technology for next-generation 3D integration in microelectronics, enabling extremely high contact and packing densities with millions of interconnects per mm², as well as improved signal integrity and energy…
20. May 2026 14:00 – 14:20 Artificial Intelligence and Digitalization Noise in SAM Data: When Similar Signals Lead to Different Diagnoses Lorenz Heinemann Fraunhofer IMWS I Germany Abstract Scanning Acoustic Microscopy (SAM) is widely used in semiconductor failure analysis, but interpreting its data remains challenging. In practice, measurement noise, caused by complex packaging structures and…
19. May 2026 17:00 – 17:20 Wide Bandgap Technolgies Revelios: Semi-automated, non-destructive crystalline defect metrology for GaN based epitaxial layers Martin Calkovsky Thermo Fisher Scientific Brno I Czech Republic Abstract Threading dislocations (TDs) are critical crystalline defects in GaN-based materials, significantly impacting the performance, reliability, and lifetime of electronic and optoelectronic devices. We present Revelios,…
20. May 2026 12:00 – 12:20 Advanced Failure Analyse Techniques Automated Ion Beam SIMS Inspection and Failure Analysis: Overcoming EDS Resolution and Sensitivity Limits Peter Gnauck Raith GmbH I Germany Abstract Advanced semiconductor devices require nanoscale chemical analysis beyond the limits of EDS. IONMASTER’s magnetic sector SIMS delivers hyperspectral imaging with <20 nm resolution and…
20. May 2026 10:00 – 10:20 Advanced Failure Analyse Techniques Capabilities of a 3D Magnetic Inverse for Localizing Faults Frederick Wellstood Neocera MAGMA LLC I US Abstract We describe a magnetic inverse that can extract a 3D current path from a magnetic field image of the path. To evaluate performance, we processed hundreds of simulated…