20. May 2025 12:00 – 12:20 MEMS & Sensors Pinpointing Leakage Defects in TSVs: A Refined Failure Analysis Approach Georg Spanring ams-OSRAM AG I Austria Abstract In 3D integrated circuit (IC) design, Through-Silicon Vias (TSVs) form vertical metal connections that pass entirely through a silicon wafer or die. They enable stacking and direct integration of…
20. May 2025 12:20 – 12:40 MEMS & Sensors Implantation related crystallographic defects in pressure sensors Bernd Haehnlein CiS Forschungsinstitut für Mikrosensorik I Germany Abstract Pressure sensors based on silicon have proven to be robust for a wide range of operating conditions. However, maintaining the electromechanical device parameters as well as their stability is of…
20. May 2025 11:40 – 12:00 MEMS & Sensors Understanding Wafer Bonded MEMS by (Failure) Analysis Roy Knechtel Schmalkalden University of Applied Sciences I Germany Abstract Wafer bonding is a key process for microsystems. The results are encapsulated chips as micro-electro-mechanical systems – wafer bonded MEMS. Wafer bonding is a mechanically strong and hermetic mounting…
20. May 2025 11:20 – 11:40 MEMS & Sensors Micromechanics without walking the plank- MEMS characterization at Infineon Regensburg Holger Pfaff Infineon Technologies I Germany Abstract MEMS have revolutionized sensor applications over the past three decades, ranging from smart environmental monitoring in phones (pressure, acceleration, voice recognition) to life-saving technologies (airbags, health monitoring). The fundamental…