20. May 2025 17:50 – 18:00 Vendor Session TESCAN Failure Analysis Roadmap Status Update Lukas Hladik TESCAN GROUP, a.s. I Czech Republic Abstract At the forefront of technological progress, TESCAN’s advanced suite of tools—including Focused Ion Beam-Scanning Electron Microscopy (FIB-SEM), Scanning Transmission Electron Microscopy (STEM), and high-resolution micro-Computed Tomography (micro-CT)—empower researchers and engineers to explore,…
20. May 2025 17:10 – 17:20 Vendor Session Mechanical Preparation of a SiC Power module – A Case Study Chris Richardson Allied High Tech Products I US Abstract When analyzing semiconductor devices, particularly for failure or construction analysis, mechanical sample preparation is crucial. The main factor for successful preparation is to use the right tools…
20. May 2025 16:40 – 16:50 Vendor Session Hamamatsu OFI roadmap Thomas Reichart Hamamatsu Photonics Deutschland GmbH I Germany Abstract The increasing demand for energy-efficient devices, such as electric vehicles (EVs) and renewable energy sources, highlights the importance of power devices for efficient energy management and conversion. New materials like SiC and GaN offer multiple…
20. May 2025 17:00 – 17:10 Vendor Session Minimizing Electron Beam Exposure to the Sample During Nanoprobing Marc Heinemann SmarAct Metrology I Germany Abstract Electrical probing of transistors at advanced technology nodes requires precise alignment of the probe and the sample. This is typically performed within a scanning electron microscope (SEM) to visualize the probe…
20. May 2025 16:50 – 17:00 Vendor Session HD Lock-in Thermography for Failure Analysis in Electronics Steffen Sturm InfraTec GmbH I Germany Abstract Lock-in thermography allows failure inspection in electronics by detection of inhomogeneous temperature distribution and local power loss in 2 dimensional and 3 dimensional way. This is achieved by using the shortest measurement…
20. May 2025 17:30 – 17:40 Vendor Session Thermo Fisher Scientific FA Road Map Ondrej Baco Thermo Fisher Scientific Brno s.r.o I Czech Republic Abstract With more than four decades innovating physical and electrical analysis solutions for the electronics industry. Thermo Fisher Scientific is one of the world’s premier providers of ultra-highresolution tools for imaging…
20. May 2025 17:20 – 17:30 Vendor Session Efficiency Meets Precision: Advanced Laser Solutions for Sample Preparation Oytun Tasgit 3D-Micromac AG I Germany Abstract Integrating femtosecond laser technology has significantly advanced sample preparation, offering unprecedented precision and speed. The microPREP® PRO FEMTO system exemplifies this innovation, utilizing ultrashort pulse lasers to enable athermal ablation with…
21. May 2025 10:20 – 10:40 GaN Electronics Cascode GaN devices for high power application Victor Sizov Nexperia I Germany Abstract III-nitrides has been gaining increased attention in the power electronics industry due to its advantageous chemical, mechanical and electrical properties marking an obvious successor in many power management applications. Based on wide band gap…