CAM-Workshop Program 2025
Day 1 (20. May 2025)
Session A: Welcome and Keynotes
| 09:00 – 09:40 | Prof. Dr. Erica Lilleodden / Frank Altmann | Fraunhofer IMWS (DE) | Welcome |
| 09:40 – 10:00 | Albert Heuberger | Fraunhofer IIS (DE) | Keynote: The APECS Pilot Line: European Chiplet Innovation |
| 10:00 – 10:40 | Kristof Croes | IMEC (BE) | Keynote: Reliability challenges of Silicon Photonic devices and its related Failure Analysis challenges |
| 10:40 – 11:20 | Mikel Azpeitia Urquia | ST Microelectronics (IT) | Keynote: MEMS: Smart sensors for a sustainable AI |
Session B: MEMS & Sensors
| 11:20 – 11:40 | Holger Pfaff | Infineon (DE) | Micromechanics without walking the plank- MEMS characterization at Infineon Regensburg |
| 11:40 – 12:00 | Roy Knechtl | University of Applied Sciences Schmalkalden (DE) | Understanding Wafer Bonded MEMS by (Failure) Analysis |
| 12:00 – 12:20 | Martin Stermitz | AMS-Osram (AT) | Pinpointing Leakage Defects in TSVs: A Refined Failure Analysis Approach |
| 12:20 – 12:40 | Bernd Hähnlein | CIS (DE) | Implantation related crystallographic defects in pressure sensors |
Session C: Emerging Fault Isolation Techniques
| 14:00 – 14:20 | Neel Leslie | Thermo Fisher Scientific (US) | E-beam Probing and E-beam-Assisted Device Alteration (EADA) for Fault Isolation in PowerVia and Advanced Technology Nodes |
| 14:20 – 14:40 | Michael Di Battista | Varioscale (US) | Innovative Approaches to Ultra Thinning Silicon to Enabling New Insights in IC Failure Analysis |
| 14:40 – 15:00 | Pascal Limbecker | GlobalFoundries (DE) | Challenges for Nanoprobing of 22nm FDSOI devices |
| 15:00 – 15:20 | Sebastian Brand | Fraunhofer IMWS (DE) | Precise 3D Defect Localization in quantitative Lock-in Thermography by analyzing the spatial phase distribution |
| 15:20 – 15:40 | Shimpei Tominaga | Hamamatsu (JP) | Application to a failure analysis of Visible ThermoDynamic ® Imaging |
| 15:40- 16:00 | Marc van Veenhuizen | NXP (NL) | RF-LIT background and use cases |
Session D: NN
| 16:40 – 18:00 | NN | ||
Day 2 (21. May 2025)
Session E: Tutorial
| 08:00 – 09:00 | Enrico Zanoni | University Padua (IT) | Tutorial: Deep level effects, failure modes and mechanisms of GaN HEMTs; current understanding and open questions |
Session F: GaN Electronics
| 09:40 – 10:20 | Thomas Detzel | Infineon Technologies Austria AG (AT) | Keynote: Gallium Nitride Power Devices and Systems: Benefits and Industrial Realization |
| 10:20 – 10:40 | Victor Sizov | Nexperia (NL) | Cascode GaN devices for high power application |
| 10:40 – 11:00 | Aidan Taylor | Infineon Villach (AT) | A direct correlation of dislocation characterization in GaN by scanning electron and scanning transmission electron microscopes |
| 11:00 – 11:20 | Marc Fouchier | Attolight (CH) | Characterisation of crystalline defects in GaN using cathodoluminescence |
| 11:20 – 11:40 | Michél Simon-Najasek | Fraunhofer IMWS (DE) | Novel approach of combined planar and cross-sectional defect analysis of stressed normally-on HEMT devices with leaky Schottky gates |
| 11:40 – 12:00 | Steve Knebel | X-FAB (DE) | Reliability characterization challenges for wide bandgap power electronics |
| 12:00 – 12:20 | Sebastian Fritzsche | Heraeus (DE) | Towards affordable GaN power modules – advanced interconnect materials & solutions |
Session G: AI Applications and FA Workflows
| 13:40 – 14:20 | Konstantin Schekotihin | University Klagenfurt (AT) | Keynote: Towards a Sustainable AI Lifecycle in FA Labs |
| 14:20 – 14:40 | Sebastian Stolwijk | BOSCH (DE) | Automated Infrared Microscopy Workflow – Image Acquisition and AI Anomaly Detection |
| 14:40 – 15:00 | Kenneth Braakmans | NXP (NL) | Implementation of AI/ML in wirebonding processes |
| 15:00 – 15:20 | Bernhard Fichtl | ZEISS Microscopy (DE) | AI assisted FA workflows |
| 15:20 – 15:40 | Amit-Kumar Choudhary | Matworks (DE) | Digital workflows and ML techniques to optimize failure analysis in microelectronics |
| 15:40 – 16:00 | Lorenz Heinemann | Fraunhofer IMWS (DE) | Simplifying ML-Based Signal Analysis in FA by Removing Equipment Related Transfer Properties |
| 16:00 – 16:20 | David Stefan Kleindiek | Kleindiek Nanotechnik (DE) | Enhancing Semiconductor Nanoprobing procedures with AI-Driven Tip Detection |
| 16:20 – 16:40 | Christoph Maier | Infineon Technologies (DE) | Failure Analysis Ontology for structuring FA knowledge and meta data in a machine and human readable format |