20. May 2026 09:20 – 10:00 Tutorial The APECS Pilot Line: European Chiplet Innovation Ulrike Ganesh Fraunhofer IZM I Germany Abstract How APECS leads the way in heterogeneous integration by providing diverse technologies on a single platform including failure analysis and material diagnostics for microelectronics Under the EU Chips Act, the APECS (Advanced Packaging and Integration for…
19. May 2026 09:20 – 10:00 Wide Bandgap Technolgies The APECS Pilot Line: European Chiplet Innovation Ulrike Ganesh Fraunhofer IZM I Germany Abstract How APECS leads the way in heterogeneous integration by providing diverse technologies on a single platform including failure analysis and material diagnostics for microelectronics Under the EU Chips Act, the APECS (Advanced Packaging and…
20. May 2026 09:20 – 10:00 Advanced Failure Analyse Techniques The APECS Pilot Line: European Chiplet Innovation Ulrike Ganesh Fraunhofer IZM I Germany Abstract How APECS leads the way in heterogeneous integration by providing diverse technologies on a single platform including failure analysis and material diagnostics for microelectronics Under the EU Chips Act, the APECS (Advanced Packaging…
20. May 2026 09:20 – 10:00 Artificial Intelligence and Digitalization The APECS Pilot Line: European Chiplet Innovation Ulrike Ganesh Fraunhofer IZM I Germany Abstract How APECS leads the way in heterogeneous integration by providing diverse technologies on a single platform including failure analysis and material diagnostics for microelectronics Under the EU Chips Act, the APECS (Advanced Packaging…
19. May 2026 11:20 – 11:40 3D Heterogeneous Integration Reliability considerations for Micro-Transfer Printing of Photonic Components Sergii Gudyriev X-FAB I Germany Abstract Micro-Transfer Printing has already been proven as successful technology for RnD and Prototyping, allowing integration of different materials and components in a single system, significantly improving the performance, or enabling unique functionality.…