19. May 2026 11:20 – 11:40 3D Heterogeneous Integration Reliability considerations for Micro-Transfer Printing of Photonic Components Sergii Gudyriev X-FAB I Germany Abstract Micro-Transfer Printing has already been proven as successful technology for RnD and Prototyping, allowing integration of different materials and components in a single system, significantly improving the performance, or enabling unique functionality.…
19. May 2026 14:40 – 15:00 3D Heterogeneous Integration Local material characterization for heterogeneous system integration using nanoindentation techniques Falk Naumann Fraunhofer IMWS I Germany Abstract Application-relevant and accurate material parameters or degradation models are essential for numerical reliability assessments of microelectronic devices. The required properties are often technology- or process-specific and can deviate significantly…
19. May 2026 11:00 – 11:20 3D Heterogeneous Integration Defect characterization of hybrid bonded systems Christopher Benndorf Fraunhofer IMWS I Germany Abstract Hybrid bonding is a key technology for next-generation 3D integration in microelectronics, enabling extremely high contact and packing densities with millions of interconnects per mm², as well as improved signal integrity and energy…
19. May 2026 14:20 – 14:40 3D Heterogeneous Integration Tescan FemtoChisel: High-Throughput Decapsulation, Delayering, and Large-Area Cross-Sectioning for Advanced Microelectronics Pouya Tavousi Tescan I US Abstract Advanced microelectronics failure analysis and metrology require rapid access through heterogeneous stacks (mold compound, underfill, metals, dielectrics, silicon). Tescan FemtoChisel is an ultrashort-pulsed laser platform for high-throughput sample preparation,…
19. May 2026 14:00 – 14:20 3D Heterogeneous Integration Microwave Induced Plasma Etching for 2.5D/3D Advanced Package Sample Preparation Jiaqi Tang JIACO Instruments I The Netherlands Abstract Advanced packages, such as 2.5D and 3D architectures, enable significant improvements in performance and bandwidth, while reducing overall footprint. However, as package complexity increases with multiple dies and…
19. May 2026 11:40 – 12:00 3D Heterogeneous Integration Failure Analysis Techniques and Lab Requirements for Silicon Photonics Fault Isolation Ryan Sweeney Globalfoundries I US Abstract As industries expand their use of silicon photonic integrated circuits (PICs), it is imperative that manufacturers be able to continuously improve the quality of their manufactured PICs. To do…
19. May 2026 13:40 – 14:00 3D Heterogeneous Integration Quantum Diamond Microscopy for Non-Destructive Failure Analysis of an Integrated Fan-Out Package-on-Package iPhone Chip Bartu Bisgin QuantumDiamonds GmbH I Germany Abstract The increasing complexity of advanced semiconductor packages, driven by chiplet architectures and 2.5D/3D integration, challenges conventional failure localization methods such as lock-in thermography (LIT) and…
19. May 2026 12:00 – 12:20 3D Heterogeneous Integration Characterization and test of photonic components in micro systems Lukas Uhlig Fraunhofer ENAS I Germany Abstract Photonics components exhibit at least electrical and optical functional properties, as in transceivers or image sensors for instance. In addition, mechanical functions may come to the fore, as it is…
20. May 2025 09:40 – 10:20 NN Reliability challenges of Silicon Photonic devices and its related Failure Analysis challenges Kristof Croes imec I Belgium Abstract Silicon photonics, a technology where optical and electronic components are integrated on the same platform, is rapidly growing from a small niche to a technology enabler for higher speed data…
19. May 2026 09:20 – 10:00 3D Heterogeneous Integration The APECS Pilot Line: European Chiplet Innovation Ulrike Ganesh Fraunhofer IZM I Germany Abstract How APECS leads the way in heterogeneous integration by providing diverse technologies on a single platform including failure analysis and material diagnostics for microelectronics Under the EU Chips Act, the APECS (Advanced Packaging and…