Tominaga
20. May 2025 15:20 – 15:40 Emerging Fault Isolation Techniques Application to a failure analysis of Visible ThermoDynamic ® Imaging Shimpei Tominaga Hamamatsu I Japan Abstract The emergence of three-dimensional (3D) semiconductor devices has increased the importance of thermal imaging techniques. We present a dual-capability system combining thermo-reflectance and thermal lock-in imaging (LIT) for high-speed,…