deWolf

Abstract, SessionA

20. May 2025 09:40 – 10:40 Welcome and Keynotes Mechanical Stress in Microelectronics: A Blessing or a Curse Ingrid de Wolf imec I Belgium Abstract Already very early in the development history of microelectronics components, researchers ran into problems with ‘stress’. Actually, one could have expected this: When putting different materials together, with different thermal…

Heuberger

Abstract, SessionA

20. May 2025 09:20 – 09:40 Welcome and Keynotes The APECS Pilot Line: European Chiplet Innovation Ulrike Ganesh Fraunhofer IZM I Germany Abstract How APECS leads the way in heterogeneous integration by providing diverse technologies on a single platform including failure analysis and material diagnostics for microelectronics Under the EU Chips Act, the APECS (Advanced Packaging and…