20. May 2025 10:00 – 10:40 Welcome and Keynotes Reliability challenges of Silicon Photonic devices and its related Failure Analysis challenges Kristof Croes imec I Belgium Abstract Silicon photonics, a technology where optical and electronic components are integrated on the same platform, is rapidly growing from a small niche to a technology enabler for higher…
20. May 2025 09:40 – 10:00 Welcome and Keynotes The APECS Pilot Line: European Chiplet Innovation Albert Heuberger Fraunhofer IIS I Germany Abstract How APECS leads the way in heterogeneous integration by providing diverse technologies on a single platform including failure analysis and material diagnostics for microelectronics Under the EU Chips Act, the APECS (Advanced Packaging and…