Albert Heuberger

How APECS leads the way in heterogeneous integration by providing diverse technologies on a single platform including failure analysis and material diagnostics for microelectronics

Under the EU Chips Act, the APECS (Advanced Packaging and Integration for Electronic Components and Systems) pilot line will drive Europe’s technological resilience and strategic autonomy. Coordinated by the Fraunhofer-Gesellschaft and implemented by the Research Fab Microelectronics Germany (FMD), APECS integrates expertise from ten partners across eight European countries. This comprehensive initiative supports large enterprises, SMEs, and start-ups by providing seamless design-to-production capabilities and enabling scalable manufacturing solutions. Through System Technology Co-Optimization (STCO), APECS advances heterogeneous system integration, essential for sectors such as telecommunications, AI/ML, high-performance computing, medical instrumentation, and industrial manufacturing. APECS strengthens Europe’s semiconductor supply chain, reduces reliance on foreign suppliers, and aligns with the European Green Deal’s sustainability goals. By enhancing Europe’s innovative capacity, APECS ensures a robust foundation for cutting-edge technology and critical applications across diverse industries.

Prof. Albert Heuberger is the spokesman of the Fraunhofer Microelectronics Group, the world’s leading research group specializing in micro- and nanoelectronic applications and systems. Additionally, he holds the position of Chairman of the Steering Committee of the Research Fab Microelectronics Germany (FMD). Prof. Heuberger’s research focuses on communication technologies for IoT, 5G communication, as well as cognitive sensor technologies for mobility, industrial control, and health applications. Since 2011, Prof. Heuberger has been the Executive Director of the Fraunhofer Institute for Integrated Circuits IIS in Erlangen, Germany.