20. May 2025

09:20 – 09:40

Welcome and Keynotes

The APECS Pilot Line: European Chiplet Innovation

Ulrike Ganesh

Fraunhofer IIS I Germany

Abstract

How APECS leads the way in heterogeneous integration by providing diverse technologies on a single platform including failure analysis and material diagnostics for microelectronics

Under the EU Chips Act, the APECS (Advanced Packaging and Integration for Electronic Components and Systems) pilot line will drive Europe’s technological resilience and strategic autonomy. Coordinated by the Fraunhofer-Gesellschaft and implemented by the Research Fab Microelectronics Germany (FMD), APECS integrates expertise from ten partners across eight European countries. This comprehensive initiative supports large enterprises, SMEs, and start-ups by providing seamless design-to-production capabilities and enabling scalable manufacturing solutions. Through System Technology Co-Optimization (STCO), APECS advances heterogeneous system integration, essential for sectors such as telecommunications, AI/ML, high-performance computing, medical instrumentation, and industrial manufacturing. APECS strengthens Europe’s semiconductor supply chain, reduces reliance on foreign suppliers, and aligns with the European Green Deal’s sustainability goals. By enhancing Europe’s innovative capacity, APECS ensures a robust foundation for cutting-edge technology and critical applications across diverse industries.

Biography

Prof. Ulrike Ganesh studied electrical engineering at the Technical University of Berlin from 1999 to 2005 and completed her doctorate there in collaboration with Credence Systems DCG in California (USA) on the subject of “Investigation of Laser Voltage Probing Signals in CMOS Transistors”. She was awarded her doctorate with the highest distinction in 2008. She continued her scientific career as a postdoc at IBM in New York from 2010 to 2012. She was then responsible for research in failure analysis at Qualcomm in San Diego. From 2016, she built on her extensive management experience in the field of chip development for the automotive industry at Robert Bosch GmbH, from where she moved to the Federal Institute for Materials Research and Testing in 2020, where she most recently headed the “Non-destructive Testing” department. Since August 2024, Prof. Ganesh, is co-chairing the Fraunhofer IZM with Prof. Martin Schneider-Ramelow.