20. May 2025

17:50 – 18:00

Vendor Session

TESCAN Failure Analysis Roadmap Status Update

Lukas Hladik

TESCAN GROUP, a.s. I Czech Republic

Abstract

At the forefront of technological progress, TESCAN’s advanced suite of tools—including Focused Ion Beam-Scanning Electron Microscopy (FIB-SEM), Scanning Transmission Electron Microscopy (STEM), and high-resolution micro-Computed Tomography (micro-CT)—empower researchers and engineers to explore, analyze, and optimize semiconductor materials and structures with unmatched clarity and precision. Our state-of-the-art solutions are designed to meet the ever-evolving demands of the semiconductor industry, enabling breakthrough insights in material characterization, failure analysis, and process development. Whether you’re pioneering the next generation of DRAM memory technologies, pushing the boundaries of 3D NAND architecture, or enhancing performance in advanced logic devices, TESCAN provides the critical imaging and analytical capabilities you need. Our technologies also play a vital role in the development and refinement of power semiconductor devices, ensuring they meet rigorous efficiency and reliability standards.

Biography

Lukas_small

Lukas Hladik is a Product Marketing Manager for FIB-SEM, characterization, and delayering/probing solutions for FA semiconductor R&D labs. He joined TESCAN GROUP, a.s. in 2012 as an application specialist for Plasma FIB-SEM platforms. All his work in TG has been connected extensively with the worldwide semiconductor industry. Lukas has a Master’s degree in Physical Engineering and Nanotechnology from Brno University of Technology, Brno, Czech Republic.