20. May 2025 18:00 – 18:10 Vendor Session Fault Isolation in the Chiplet Packaging Era Martin Igarashi TeraView LTD. I USA Abstract The semiconductor industry still has the compelling need to cost effectively produce higher performance computing devices such as AI applications. The industry’s answer is to adopted chiplet-based architectures. The chiplet architecture offers the…
20. May 2025 17:50 – 18:00 Vendor Session TESCAN Failure Analysis Roadmap Status Update Lukas Hladik TESCAN GROUP, a.s. I Czech Republic Abstract At the forefront of technological progress, TESCAN’s advanced suite of tools—including Focused Ion Beam-Scanning Electron Microscopy (FIB-SEM), Scanning Transmission Electron Microscopy (STEM), and high-resolution micro-Computed Tomography (micro-CT)—empower researchers and engineers to explore,…
20. May 2025 17:10 – 17:20 Vendor Session Mechanical Preparation of a SiC Power module – A Case Study Chris Richardson Allied High Tech Products I US Abstract When analyzing semiconductor devices, particularly for failure or construction analysis, mechanical sample preparation is crucial. The main factor for successful preparation is to use the right tools…
20. May 2025 16:40 – 16:50 Vendor Session Hamamatsu OFI roadmap Thomas Reichart Hamamatsu Photonics Deutschland GmbH I Germany Abstract The increasing demand for energy-efficient devices, such as electric vehicles (EVs) and renewable energy sources, highlights the importance of power devices for efficient energy management and conversion. New materials like SiC and GaN offer multiple…
20. May 2025 17:00 – 17:10 Vendor Session Minimizing Electron Beam Exposure to the Sample During Nanoprobing Marc Heinemann SmarAct Metrology I Germany Abstract Electrical probing of transistors at advanced technology nodes requires precise alignment of the probe and the sample. This is typically performed within a scanning electron microscope (SEM) to visualize the probe…
20. May 2025 16:50 – 17:00 Vendor Session HD Lock-in Thermography for Failure Analysis in Electronics Steffen Sturm InfraTec GmbH I Germany Abstract Lock-in thermography allows failure inspection in electronics by detection of inhomogeneous temperature distribution and local power loss in 2 dimensional and 3 dimensional way. This is achieved by using the shortest measurement…
20. May 2025 17:30 – 17:40 Vendor Session Thermo Fisher Scientific FA Road Map Ondrej Baco Thermo Fisher Scientific Brno s.r.o I Czech Republic Abstract With more than four decades innovating physical and electrical analysis solutions for the electronics industry. Thermo Fisher Scientific is one of the world’s premier providers of ultra-highresolution tools for imaging…
21. May 2025 16:00 – 16:20 AI Applications and FA Workflows Enhancing Semiconductor Nanoprobing procedures with AI-Driven Tip Detection David Kleindiek Kleindiek Nanotechnik I Germany Abstract The automation of nanoprobing application relies on the accurate detection of probe tips in scanning electron microscope (SEM) images. This work explores the application of deep learning models to…
20. May 2025 12:00 – 12:20 MEMS & Sensors Pinpointing Leakage Defects in TSVs: A Refined Failure Analysis Approach Georg Spanring ams-OSRAM AG I Austria Abstract In 3D integrated circuit (IC) design, Through-Silicon Vias (TSVs) form vertical metal connections that pass entirely through a silicon wafer or die. They enable stacking and direct integration of…
20. May 2025 14:20 – 14:40 Emerging Fault Isolation Techniques Innovative Approaches to Ultra Thinning Silicon to Enabling New Insights in IC Failure Analysis Michael DiBattista Varioscale, Inc. I US Abstract Integrated Circuit (IC) backside sample preparation is a critical step in semiconductor failure analysis eabling fault isolation to improve yield and investigate design modifications.…