20. May 2025 10:40 – 11:20 Welcome and Keynotes MEMS: Smart sensors for a sustainable AI Mikel Azpeitia Urquia STMicroelectronics I Italy Abstract Micro-Electro-Mechanical Systems (MEMS) have revolutionized the semiconductor industry by seamlessly integrating electronics and mechanics to drive innovation in sensing and actuation at the microscopic scale. In a landscape shaped by the rapid…
20. May 2025 10:00 – 10:40 Welcome and Keynotes Reliability challenges of Silicon Photonic devices and its related Failure Analysis challenges Kristof Croes imec I Belgium Abstract Silicon photonics, a technology where optical and electronic components are integrated on the same platform, is rapidly growing from a small niche to a technology enabler for higher…
20. May 2025 09:40 – 10:00 Welcome and Keynotes The APECS Pilot Line: European Chiplet Innovation Albert Heuberger Fraunhofer IIS I Germany Abstract How APECS leads the way in heterogeneous integration by providing diverse technologies on a single platform including failure analysis and material diagnostics for microelectronics Under the EU Chips Act, the APECS (Advanced Packaging and…