19. May 2026 11:00 – 11:20 3D Heterogeneous Integration Defect characterization of hybrid bonded systems Christopher Benndorf Fraunhofer IMWS I Germany Abstract NN Biography Studied chemistry, followed by a PhD in inorganic solid-state chemistry and physical chemistry at Westfälische Wilhelms-Universität Münster, with a focus on solid-state NMR spectroscopy of intermetallic phases and polypnictides. Research associate…
19. May 2026 14:20 – 14:40 3D Heterogeneous Integration Tescan FemtoChisel: High-Throughput Decapsulation, Delayering, and Large-Area Cross-Sectioning for Advanced Microelectronics Pouya Tavousi Tescan I US Abstract Advanced microelectronics failure analysis and metrology require rapid access through heterogeneous stacks (mold compound, underfill, metals, dielectrics, silicon). Tescan FemtoChisel is an ultrashort-pulsed laser platform for high-throughput sample preparation,…
19. May 2026 14:00 – 14:20 3D Heterogeneous Integration Microwave Induced Plasma Etching for 2.5D/3D Advanced Package Sample Preparation Jiaqi Tang JIACO Instruments I The Netherlands Abstract Advanced packages, such as 2.5D and 3D architectures, enable significant improvements in performance and bandwidth, while reducing overall footprint. However, as package complexity increases with multiple dies and…
19. May 2026 11:40 – 12:00 3D Heterogeneous Integration Failure Analysis Techniques and Lab Requirements for Silicon Photonics Fault Isolation Ryan Sweeney Globalfoundries I US Abstract As industries expand their use of silicon photonic integrated circuits (PICs), it is imperative that manufacturers be able to continuously improve the quality of their manufactured PICs. To do…
19. May 2026 13:40 – 14:00 3D Heterogeneous Integration Quantum Diamond Microscopy for Non-Destructive Failure Analysis of an Integrated Fan-Out Package-on-Package iPhone Chip Bartu Bisgin QuantumDiamonds GmbH I Germany Abstract The increasing complexity of advanced semiconductor packages, driven by chiplet architectures and 2.5D/3D integration, challenges conventional failure localization methods such as lock-in thermography (LIT) and…
19. May 2026 12:00 – 12:20 3D Heterogeneous Integration Characterization and test of photonic components in micro systems Lukas Uhlig Fraunhofer ENAS I Germany Abstract Photonics components exhibit at least electrical and optical functional properties, as in transceivers or image sensors for instance. In addition, mechanical functions may come to the fore, as it is…