20. May 2025 14:20 – 14:40 Emerging Fault Isolation Techniques Innovative Approaches to Ultra Thinning Silicon to Enabling New Insights in IC Failure Analysis Michael DiBattista Varioscale, Inc. I US Abstract Integrated Circuit (IC) backside sample preparation is a critical step in semiconductor failure analysis eabling fault isolation to improve yield and investigate design modifications.…
20. May 2025 15:00 – 15:20 Emerging Fault Isolation Techniques Precise 3D Defect Localization in quantitative Lock-in Thermography by analyzing the spatial phase distribution Sebastian Brand Fraunhofer IMWS I Germany Abstract Ongoing advances in functionality and computational performance of microelectronic devices require continuation in the developments in the underlying technologies for e.g., interconnect and packaging…
20. May 2025 14:00 – 14:20 Emerging Fault Isolation Techniques Exploring the Capabilities and Applications of E-beam probing for Failure Analysis Neel Leslie Thermofisher Scientific I USA Abstract Electron beam probing has emerged as an emerging technique in the field of failure analysis, offering unparalleled insights into probing capabilities and characterization of semiconductor devices. This…
20. May 2025 14:40 – 15:00 Emerging Fault Isolation Techniques Challenges for Nanoprobing of 22nm FDSOI devices Pascal Limbecker GlobalFoundries Dresden Module One LLC & Co. KG I Germany Abstract Globalfoundries’ 22nm FDSOI (22FDX®) technology offers full SoC integration including digital, analog and RF. It combines high performance and ultra-low power. With body-biasing it is…
20. May 2025 15:40 – 16:00 Emerging Fault Isolation Techniques RF-LIT background and use cases Marc van Veenhuizen NXP I The Netherlands Abstract Lockin Thermography is a great failure analysis technique to investigate shorts or in general resistive connections. By applying an RF-stimulus, it will be shown in this presentation that the technique can be…
20. May 2025 15:20 – 15:40 Emerging Fault Isolation Techniques Application to a failure analysis of Visible ThermoDynamic ® Imaging Shimpei Tominaga Hamamatsu I Japan Abstract The emergence of three-dimensional (3D) semiconductor devices has increased the importance of thermal imaging techniques. We present a dual-capability system combining thermo-reflectance and thermal lock-in imaging (LIT) for high-speed,…