Marvin Holten

The transition to advanced 3D integrated circuits and system-in-package designs is creating major challenges for fault detection, yield optimisation, and process understanding. Existing inspection and failure-analysis methods often cannot provide the non-invasive, depth-resolved electrical information needed to study complex current paths and buried faults in these architectures.

We are developing a Quantum Diamond Magnetic Microscope based on NV-diamond sensors for real-time magnetic imaging of integrated circuits. Our goal is to enable non-invasive 3D current mapping with sub-micron resolution, high sensitivity, and high acquisition speed, beyond the limits of conventional inspection tools and current wide-field quantum sensing systems.

We have built first laboratory prototypes and demonstrated targeted single-pixel sensitivities of 5–10 nT/√Hz. In the talk, I will present the system concept, discuss the current prototype status, and show first measurement results on test structures and semiconductor samples. I will also outline the remaining engineering steps toward a robust instrument for semiconductor metrology and failure analysis.

Marvin Holten is CTO and co-founder of DiaSense, a quantum sensing startup founded in 2024. DiaSense develops NV-diamond quantum magnetic microscopes for neuroscience, semiconductor manufacturing, and materials science. He earned a Ph.D. in Physics from the University of Heidelberg, where he studied superfluidity and many-body systems, and later worked at TU Wien on quantum computing nodes based on neutral atoms and optical cavities. His expertise includes quantum technologies, advanced optical systems, and quantum computing and simulation with ultracold atoms.