20. May 2026

11:40 – 12:00

Advanced Failure Analyse Techniques

Ultra-Thin Ga-Free Lamella Preparation Enabling Pristine Structural-Chemical Analysis of Advanced Technology Nodes

Letian Li

ThermoFisher Scientific I The Netherlands

Abstract

Ultra-thin, precisely targeted lamella preparation on advanced IC devices has traditionally been considered a Ga-FIB application. However, recent advances in semiconductor processing now require gallium-free lamella preparation, particularly at the latest technology nodes. In this study, we demonstrate how high-quality, on-target lamellae can be successfully prepared using Multi-ion species plasma FIB, meeting the demands of advanced device analysis without introducing Gallium into the system. The talk will focusing on procedures to make the lamella as well as qualifying the final result with TEM.

Biography

Letian Li is a semiconductor and materials science professional at Thermo Fisher Scientific, with more than 10 years of experience across technical and commercial roles. He currently serves as a Senior Product Specialist in Semiconductors, based in Eindhoven. Previously, he worked as Market Development Manager for Batteries and as a Senior Application Specialist, focusing on product demonstrations, application development, and customer training. Letian began his career at FEI Company as an Applications Engineer. He holds a PhD and MSc in Materials Engineering from Loughborough University.