Pouya Tavousi

Advanced microelectronics failure analysis and metrology require rapid access through heterogeneous stacks (mold compound, underfill, metals, dielectrics, silicon). Tescan FemtoChisel is an ultrashort-pulsed laser platform for high-throughput sample preparation, focused on decapsulation/delayering and millimeter-scale cross-sectioning. It removes encapsulants to expose die/package regions for optical/SEM inspection and probing, performs stepwise delayering to reveal circuitry, silicon, and interposer metallization, and produces large-area cross sections with high feature visibility. These capabilities are enabled by intelligent multigas processing (during/between scans) to control plume, cooling, and debris evacuation, plus a removable laser protective layer (LPL) that suppresses peripheral beam interactions and protects nearby features during high-energy ablation. Together they reduce redeposition and collateral damage, expanding the usable high-fluence window for scalable advanced-package FA.

Pouya Tavousi is Head of AI and Advanced Solutions at TESCAN and previously co-founded FemtoInnovations, which was acquired by TESCAN in 2025. He leads advanced solution development at the intersection of ultrafast laser micromachining, correlative microscopy, and AI-enabled laser processing and image analysis. His work focuses on automating end-to-end workflows that fuse multimodal imaging with data-driven navigation, and on developing software that enables high-throughput sample preparation for advanced microelectronics—including decapsulation, delayering, and large-area cross-sectioning—for failure analysis and metrology.