20. May 2025 15:20 – 15:40 Emerging Fault Isolation Techniques Application to a failure analysis of Visible ThermoDynamic ® Imaging Shimpei Tominaga Hamamatsu I Japan Abstract The emergence of three-dimensional (3D) semiconductor devices has increased the importance of thermal imaging techniques. We present a dual-capability system combining thermo-reflectance and thermal lock-in imaging (LIT) for high-speed,…
21. May 2025 11:20 – 11:40 GaN Electronics Novel approach of combined planar and cross-sectional defect analysis of stressed normally-on HEMT devices with leaky Schottky gates Michél Simon-Najasek Fraunhofer IMWS I Germany Abstract The clear correlation of defect localization by Electroluminescence to nanometer sized defects at Schottky gate contacts of GaN HEMTs are always challenging…
21. May 2025 10:40 – 11:00 GaN Electronics A direct correlation of dislocation characterization in GaN by scanning electron and scanning transmission electron microscopes Aidan Taylor Infineon Villach I Austria Abstract Understanding the distribution of crystal defects is an important topic for semiconductor materials. This is particularly challenging for gallium nitride on silicon (GaN-on-Si) as…
21. May 2025 13:40 – 14:20 AI Applications and FA Workflows Towards a Sustainable AI Lifecycle in FA Labs Konstantin Schekotihin University Klagenfurt I Austria Abstract Various AI applications in Failure Analysis (FA) have already shown that many routine tasks can be successfully automated. These tasks include identifying physical failures in images, labeling job reports,…
21. May 2025 09:40 – 10:20 GaN electronics Gallium Nitride Power Devices and Systems: Benefits and Industrial Realization Thomas Detzel Infineon Technologies Austria AG I Austria Abstract Power Semiconductors based on Gallium-Nitride (GaN) will provide a major contribution to energy and material efficiency in power electronics. At the moment we are privileged to witness the…
20. May 2025 10:40 – 11:20 Welcome and Keynotes MEMS: Smart sensors for a sustainable AI Mikel Azpeitia Urquia STMicroelectronics I Italy Abstract Micro-Electro-Mechanical Systems (MEMS) have revolutionized the semiconductor industry by seamlessly integrating electronics and mechanics to drive innovation in sensing and actuation at the microscopic scale. In a landscape shaped by the rapid…
20. May 2025 10:00 – 10:40 Welcome and Keynotes Reliability challenges of Silicon Photonic devices and its related Failure Analysis challenges Kristof Croes imec I Belgium Abstract Silicon photonics, a technology where optical and electronic components are integrated on the same platform, is rapidly growing from a small niche to a technology enabler for higher…
20. May 2025 09:40 – 10:00 Welcome and Keynotes The APECS Pilot Line: European Chiplet Innovation Albert Heuberger Fraunhofer IIS I Germany Abstract How APECS leads the way in heterogeneous integration by providing diverse technologies on a single platform including failure analysis and material diagnostics for microelectronics Under the EU Chips Act, the APECS (Advanced Packaging and…
Individual SponsorshipWhy choose this package? The Custom Sponsorship Package provides a unique opportunity for organizations to showcase their creativity and align their brand with innovative ideas. By selecting this package, sponsors have the flexibility to propose personalized sponsorship concepts, such as sponsoring a coffee cart or introducing interactive elements that enhance attendee experience. This tailored approach…
Bronze SponsorshipWhy choose this package? The Bronze sponsorship provides a vital opportunity to engage with a diverse audience, including over 150 participants from academia and industry. What you get: Logo on all printed materials, including the workshop program flyer Logo on opening and closing slides Logo displayed on our workshop website 1 complimentary registrations for…