21. May 2025 16:00 – 16:20 AI Applications and FA Workflows Enhancing Semiconductor Nanoprobing procedures with AI-Driven Tip Detection David Kleindiek Kleindiek Nanotechnik I Germany Abstract The automation of nanoprobing application relies on the accurate detection of probe tips in scanning electron microscope (SEM) images. This work explores the application of deep learning models to…
21. May 2025 15:20 – 15:40 AI Applications and FA Workflows Digital workflows and ML techniques to optimize failure analysis in microelectronics Amit Choudhary Matworks GmbH I Germany Abstract Failure analysis (FA) in microelectronics is becoming increasingly complex due to the miniaturization of components and the growing need for precise defect detection. Traditional FA workflows…
21. May 2025 14:20 – 14:40 AI Applications and FA Workflows Automated Infrared Microscopy Workflow – Image Acquisition and AI Anomaly Detection Sebastian Stolwijk Robert Bosch GmbH I Germany Abstract Infrared (IR) microscopy is a powerful tool for defect analysis in Micro-Electro-Mechanical Systems (MEMS) and Application-Specific Integrated Circuit (ASIC) devices. A steep increase in IR…
21. May 2025 15:40 – 16:00 AI Applications and FA Workflows Simplifying ML-Based Signal Analysis in FA by Removing Equipment Related Transfer Properties Lorenz Heinemann Fraunhofer IMWS I Germany Abstract AI-driven failure analysis in acoustic microscopy is often constrained by measurement setup dependencies, requiring models to be trained for specific configurations – such as transducer…
21. May 2025 15:00 – 15:20 AI Applications and FA Workflows Speeding up FA workflows by AI – first results from the FA2IR project Bernhard Fichtl Carl Zeiss Microscopy GmbH I Germany Abstract Arivis Cloud is a web platform that enables failure analysts & other customers to leverage the power of Deep Learning without any…
21. May 2025 14:40 – 15:00 AI Applications and FA Workflows Leveraging Machine Signals for Device-Level Quality Detection and Automatic Root Cause Analysis in Semiconductor Wire Bonding Kenneth J. Braakman NXP Semiconductors I The Netherlands Abstract This presentation focuses on leveraging machine signal data from wire bond machines by building data-driven solutions to enhance root…
21. May 2025 13:40 – 14:20 AI Applications and FA Workflows Towards a Sustainable AI Lifecycle in FA Labs Konstantin Schekotihin University Klagenfurt I Austria Abstract Various AI applications in Failure Analysis (FA) have already shown that many routine tasks can be successfully automated. These tasks include identifying physical failures in images, labeling job reports,…