CAM-Workshop Program 2024

Day 1 (4. June 2024)

Session A: Welcome and Keynotes

09:00 – 09:20 Prof. Dr. Erica Lilleodden /  Frank Altmann Fraunhofer IMWS (DE) Welcome
09:20 – 10:00 Frank Fournel CEA-Leti (F) Keynote: Characterisation needs in wafer-to-wafer and die-to-wafer direct bonding
10:00 – 10:40 Anton Chichkov Chips Joint Undertaking (BE) Keynote: EU Chips Act – An Introduction

Session C: Novel Failure Analysis Techniques

Session D: Panel Discussion

Day 2 (5. June 2024)

Session E: Tutorial

Session F: Wide Band Gap Power Electronics

09:40 – 10:20 Peter Friedrichs Infineon Technologies AG (DE) Keynote: SiC power devices and related robustness and reliability aspects
10:20 – 10:40 Thorsten Vehoff Heraeus Electronics GmbH (DE) Robustness for power electronic packaging
10:40 – 11:00 Dick Scholten Robert Bosch GmbH (DE) Gate-switching instability in silicon carbide power MOSFET’s
11:00 – 11:20 Andreas Graff Fraunhofer IWMS (DE) Integration of free-standing single crystal diamond (SCD) nanomembranes in ultra-wide bandgap electronics
11:20 – 11:40 Antoine Reverdy Sector Technologies (FR) Power devices Failure Analysis Use Cases Using High voltage OBIRCh workflows

Session G: Failure Analysis Workflows and Digitalization

13:00 – 13:40 Prof. Dr. Zhiheng Huang Sun Yat-sen University (CN) Keynote: Applied Microstructure for AI: From Electrons to Devices & From Diagnostics to Informatics
13:40 – 14:00 Allen Gu Carl Zeiss Research Microscopy Solutions (US) An Artificial Intelligence Powered Reconstruction and Metrology Workflow for Semiconductor Packaging Development using High-Resolution 3D X-ray Microscopy
14:00 – 14:20 Amit Kumar Choudhary Matworks GmbH (DE) ML assisted defect detection for reliable failure analysis in microelectronic components
14:20 – 14:40 Fabian Rudau Robert Bosch GmbH (DE) In Depth Logic Analysis on Digital Designs
14:40 – 15:00 Christian Hollerith Infineon AG (DE) Integrated Workflows for Failure Analysis
15:00 – 15:20 Libor Strakoš Thermo Fisher Scientific (CZ) In-situ AFM-in-(FIB)SEM workflow for site-specific & correlative failure analysis of semiconductors
15:20 – 15:40 Oscar Recalde Kleindiek Nanotechnik GmbH (DE) Automated SEM/EBIC Workflow for Wafer Level Failure Analysis