20. May 2025 17:10 – 17:20 Vendor Session Mechanical Preparation of a SiC Power module – A Case Study Chris Richardson Allied High Tech Products I US Abstract When analyzing semiconductor devices, particularly for failure or construction analysis, mechanical sample preparation is crucial. The main factor for successful preparation is to use the right tools…
20. May 2025 16:40 – 16:50 Vendor Session Hamamatsu OFI roadmap Thomas Reichart Hamamatsu Photonics Deutschland GmbH I Germany Abstract The increasing demand for energy-efficient devices, such as electric vehicles (EVs) and renewable energy sources, highlights the importance of power devices for efficient energy management and conversion. New materials like SiC and GaN offer multiple…