20. May 2025 12:20 – 12:40 MEMS & Sensors Implantation related crystallographic defects in pressure sensors Bernd Haehnlein CiS Forschungsinstitut für Mikrosensorik I Germany Abstract Pressure sensors based on silicon have proven to be robust for a wide range of operating conditions. However, maintaining the electromechanical device parameters as well as their stability is of…
21. May 2025 15:20 – 15:40 AI Applications and FA Workflows Digital workflows and ML techniques to optimize failure analysis in microelectronics Amit Choudhary Matworks GmbH I Germany Abstract Failure analysis (FA) in microelectronics is becoming increasingly complex due to the miniaturization of components and the growing need for precise defect detection. Traditional FA workflows…
20. May 2025 11:40 – 12:00 MEMS & Sensors Understanding Wafer Bonded MEMS by (Failure) Analysis Roy Knechtel Schmalkalden University of Applied Sciences I Germany Abstract Wafer bonding is a key process for microsystems. The results are encapsulated chips as micro-electro-mechanical systems – wafer bonded MEMS. Wafer bonding is a mechanically strong and hermetic mounting…
21. May 2025 14:20 – 14:40 AI Applications and FA Workflows Automated Infrared Microscopy Workflow – Image Acquisition and AI Anomaly Detection Sebastian Stolwijk Robert Bosch GmbH I Germany Abstract Infrared (IR) microscopy is a powerful tool for defect analysis in Micro-Electro-Mechanical Systems (MEMS) and Application-Specific Integrated Circuit (ASIC) devices. A steep increase in IR…
21. May 2025 15:40 – 16:00 AI Applications and FA Workflows Simplifying ML-Based Signal Analysis in FA by Removing Equipment Related Transfer Properties Lorenz Heinemann Fraunhofer IMWS I Germany Abstract AI-driven failure analysis in acoustic microscopy is often constrained by measurement setup dependencies, requiring models to be trained for specific configurations – such as transducer…
21. May 2025 12:00 – 12:20 GaN Electronics Towards affordable GaN power modules – advanced interconnect materials & solutions Sebastian Fritzsche Heraeus Electronics GmbH & Co. KG I Germany Abstract The manufacturing of affordable GaN power modules continues to present unique challenges and opportunities for advanced packaging technologies. Heraeus Electronics is working on innovative interconnect…
20. May 2025 11:20 – 11:40 MEMS & Sensors Micromechanics without walking the plank- MEMS characterization at Infineon Regensburg Holger Pfaff Infineon Technologies I Germany Abstract MEMS have revolutionized sensor applications over the past three decades, ranging from smart environmental monitoring in phones (pressure, acceleration, voice recognition) to life-saving technologies (airbags, health monitoring). The fundamental…
20. May 2025 14:00 – 14:20 Emerging Fault Isolation Techniques Exploring the Capabilities and Applications of E-beam probing for Failure Analysis Neel Leslie Thermofisher Scientific I USA Abstract Electron beam probing has emerged as an emerging technique in the field of failure analysis, offering unparalleled insights into probing capabilities and characterization of semiconductor devices. This…
21. May 2025 15:00 – 15:20 AI Applications and FA Workflows Speeding up FA workflows by AI – first results from the FA2IR project Bernhard Fichtl Carl Zeiss Microscopy GmbH I Germany Abstract Arivis Cloud is a web platform that enables failure analysts & other customers to leverage the power of Deep Learning without any…