19. May 2026 13:40 – 14:00 3D Heterogeneous Integration Quantum Diamond Microscopy for Non-Destructive Failure Analysis of an Integrated Fan-Out Package-on-Package iPhone Chip Bartu Bisgin QuantumDiamonds GmbH I Germany Abstract The increasing complexity of advanced semiconductor packages, driven by chiplet architectures and 2.5D/3D integration, challenges conventional failure localization methods such as lock-in thermography (LIT) and…
19. May 2026 12:00 – 12:20 3D Heterogeneous Integration Characterization and test of photonic components in micro systems Lukas Uhlig Fraunhofer ENAS I Germany Abstract Photonics components exhibit at least electrical and optical functional properties, as in transceivers or image sensors for instance. In addition, mechanical functions may come to the fore, as it is…
20. May 2026 10:40 – 11:00 Advanced Failure Analyse Techniques Localization of Package Defects in Semiconductor Devices by EOTPR Markus Pfeiffer Robert Bosch GmbH I Germany Abstract This presentation introduces Electro-Optic Terahertz Pulse Reflectometry (EOTPR) as a non-destructive method for the localization of electrical opens and shorts within semiconductor device packages. EOTPR operates by generating…
20. May 2026 11:00 – 11:20 Advanced Failure Analyse Techniques Ultra-Low pA-level Noise EBIC and RCI of High Impedance Samples René Hammer point electronic I Germany Abstract Nanoprobing imaging equipment for Electron Beam Absorbed Current/Resistive Contrast Imaging (EBAC/RCI) and Electron Beam Induced Current (EBIC) techniques is widely used in the semiconductor industry for process control…