19. May 2026 16:40 – 17:00 Wide Bandgap Technolgies Materials and Device Challenges of UWBG AlN/AlGaN for Power Electronics Mervi Paulasto-Kröckel Marek Patocka Aalto University I Finland Abstract UWBG AlN and AlGaN are attracting increasing interest for next-generation power electronics, but their development involves major challenges in epitaxy, contacting and device design as material composition…
20. May 2026 11:20 – 11:40 Advanced Failure Analyse Techniques See while you mill – SEM guided FIB milling and low-kV finishing for leading-edge node semiconductor FA with ZEISS Crossbeam 750 Heiko Stegmann Carl Zeiss Microscopy GmbH I Germany Abstract The requirements to sample preparation for transmission electron microscopy (TEM) using combined scanning electron microscope…
20. May 2026 14:40 – 15:00 Artificial Intelligence and Digitalization Integrated Digital Workflows for Accelerated Failure Analysis and Enhanced Yield Learning in Semiconductor Manufacturing Michael Fritzsche GlobalFoundries Fab1 I Germany Abstract Failure analysis in semiconductor manufacturing requires fast and reliable access to many different data sources. As IT environments continue shifting toward cloud‑based solutions, traditional,…