21. May 2025 10:40 – 11:00 GaN Electronics A direct correlation of dislocation characterization in GaN by scanning electron and scanning transmission electron microscopes Aidan Taylor Infineon Villach I Austria Abstract Understanding the distribution of crystal defects is an important topic for semiconductor materials. This is particularly challenging for gallium nitride on silicon (GaN-on-Si) as…
21. May 2025 13:40 – 14:20 AI Applications and FA Workflows Towards a Sustainable AI Lifecycle in FA Labs Konstantin Schekotihin University Klagenfurt I Austria Abstract Various AI applications in Failure Analysis (FA) have already shown that many routine tasks can be successfully automated. These tasks include identifying physical failures in images, labeling job reports,…
21. May 2025 09:40 – 10:20 GaN electronics Gallium Nitride Power Devices and Systems: Benefits and Industrial Realization Thomas Detzel Infineon Technologies Austria AG I Austria Abstract Power Semiconductors based on Gallium-Nitride (GaN) will provide a major contribution to energy and material efficiency in power electronics. At the moment we are privileged to witness the…
20. May 2025 10:40 – 11:20 Welcome and Keynotes MEMS: Smart sensors for a sustainable AI Mikel Azpeitia Urquia STMicroelectronics I Italy Abstract Micro-Electro-Mechanical Systems (MEMS) have revolutionized the semiconductor industry by seamlessly integrating electronics and mechanics to drive innovation in sensing and actuation at the microscopic scale. In a landscape shaped by the rapid…
20. May 2025 09:40 – 10:40 Welcome and Keynotes Mechanical Stress in Microelectronics: A Blessing or a Curse Ingrid de Wolf imec I Belgium Abstract Already very early in the development history of microelectronics components, researchers ran into problems with ‘stress’. Actually, one could have expected this: When putting different materials together, with different thermal…
20. May 2025 09:20 – 09:40 Welcome and Keynotes The APECS Pilot Line: European Chiplet Innovation Ulrike Ganesh Fraunhofer IZM I Germany Abstract How APECS leads the way in heterogeneous integration by providing diverse technologies on a single platform including failure analysis and material diagnostics for microelectronics Under the EU Chips Act, the APECS (Advanced Packaging and…