19. May 2026 11:40 – 12:00 3D Heterogeneous Integration Failure Analysis Techniques and Lab Requirements for Silicon Photonics Fault Isolation Ryan Sweeney Globalfoundries I US Abstract As industries expand their use of silicon photonic integrated circuits (PICs), it is imperative that manufacturers be able to continuously improve the quality of their manufactured PICs. To do…
20. May 2026 14:20 – 14:40 Artificial Intelligence and Digitalization Exploring the value of instance segmentation & other AI methods for Failure Analysis Bernhard Fichtl Carl Zeiss Microscopy GmbH I Germany Abstract Failure analysis increasingly depends on high‑resolution imaging, but extracting quantitative information from large datasets is still manual and slow. This talk explores how…
19. May 2026 16:20 – 16:40 Wide Bandgap Technolgies Diamond-based technologies for active device and thermal cooling integration Matthias Muehle Fraunhofer CMW I US Abstract Diamond is an ultra-wide bandgap semiconductor material, whose electric properties make it a great choice as p-type material for device integration. Further, diamond possesses the highest thermal conductivity, which also…
20. May 2026 11:40 – 12:00 Advanced Failure Analyse Techniques Ultra-Thin Ga-Free Lamella Preparation Enabling Pristine Structural-Chemical Analysis of Advanced Technology Nodes Letian Li ThermoFisher Scientific I The Netherlands Abstract Ultra-thin, precisely targeted lamella preparation on advanced IC devices has traditionally been considered a Ga-FIB application. However, recent advances in semiconductor processing now require gallium-free…