20. May 2025 17:20 – 17:30 Vendor Session Efficiency Meets Precision: Advanced Laser Solutions for Sample Preparation Oytun Tasgit 3D-Micromac AG I Germany Abstract Integrating femtosecond laser technology has significantly advanced sample preparation, offering unprecedented precision and speed. The microPREP® PRO FEMTO system exemplifies this innovation, utilizing ultrashort pulse lasers to enable athermal ablation with…
21. May 2025 11:00 – 11:20 GaN Electronics Defect characterization in compound semiconductors using cathodoluminescence Marc Fouchier Attolight I Switzerland Abstract Cathodoluminescence (CL) consists in the analysis of the light emitted in the UV-IR range by a material upon its excitation with an electron beam. This technique is particularly useful in compound semiconductors, such as…
21. May 2025 08:00 – 09:00 Tutorial Deep level effects, failure modes and mechanisms of GaN HEMTs; current understanding and open questions Enrico Zanoni University of Padova I Italy Abstract This tutorial will review recent results concerning deep levels in GaN HEMT, their physical origin, their effects on device operation, the experimental techniques adopted for…
20. May 2025 15:00 – 15:20 Emerging Fault Isolation Techniques Precise 3D Defect Localization in quantitative Lock-in Thermography by analyzing the spatial phase distribution Sebastian Brand Fraunhofer IMWS I Germany Abstract Ongoing advances in functionality and computational performance of microelectronic devices require continuation in the developments in the underlying technologies for e.g., interconnect and packaging…
20. May 2025 12:20 – 12:40 MEMS & Sensors Implantation related crystallographic defects in pressure sensors Bernd Haehnlein CiS Forschungsinstitut für Mikrosensorik I Germany Abstract Pressure sensors based on silicon have proven to be robust for a wide range of operating conditions. However, maintaining the electromechanical device parameters as well as their stability is of…
21. May 2025 15:20 – 15:40 AI Applications and FA Workflows Digital workflows and ML techniques to optimize failure analysis in microelectronics Amit Choudhary Matworks GmbH I Germany Abstract Failure analysis (FA) in microelectronics is becoming increasingly complex due to the miniaturization of components and the growing need for precise defect detection. Traditional FA workflows…
20. May 2025 11:40 – 12:00 MEMS & Sensors Understanding Wafer Bonded MEMS by (Failure) Analysis Roy Knechtel Schmalkalden University of Applied Sciences I Germany Abstract Wafer bonding is a key process for microsystems. The results are encapsulated chips as micro-electro-mechanical systems – wafer bonded MEMS. Wafer bonding is a mechanically strong and hermetic mounting…
21. May 2025 14:20 – 14:40 AI Applications and FA Workflows Automated Infrared Microscopy Workflow – Image Acquisition and AI Anomaly Detection Sebastian Stolwijk Robert Bosch GmbH I Germany Abstract Infrared (IR) microscopy is a powerful tool for defect analysis in Micro-Electro-Mechanical Systems (MEMS) and Application-Specific Integrated Circuit (ASIC) devices. A steep increase in IR…
21. May 2025 15:40 – 16:00 AI Applications and FA Workflows Simplifying ML-Based Signal Analysis in FA by Removing Equipment Related Transfer Properties Lorenz Heinemann Fraunhofer IMWS I Germany Abstract AI-driven failure analysis in acoustic microscopy is often constrained by measurement setup dependencies, requiring models to be trained for specific configurations – such as transducer…
21. May 2025 12:00 – 12:20 GaN Electronics Towards affordable GaN power modules – advanced interconnect materials & solutions Sebastian Fritzsche Heraeus Electronics GmbH & Co. KG I Germany Abstract The manufacturing of affordable GaN power modules continues to present unique challenges and opportunities for advanced packaging technologies. Heraeus Electronics is working on innovative interconnect…